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Olivia Clarlee
Phone: (410) 510-6142 | Email: Olivia.clarlee57@yahoo.com
Address:
210
Green Vally ž Manhattan, DN 11205
Olivia Clarlee
Page 2
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Olivia Clarlee
Phone: (410) 510-6142 | Email: Olivia.clarlee57@yahoo.com
Address:
210
Green Vally ž Manhattan, DN 11205
Summary of Qualifications
Detail-oriented, dedicated, and highly qualified professional with 9+
years of experience in electrical engineering as a Product & Manufacturing
Engineer. Solid analytical, communication, critical thinking, problem solving,
and troubleshooting skills. Expertise in data analysis, DC testing, and
manufacturing. Currently seeking a position as a Product/Manufacturing Engineer
which will utilize all skills, abilities, and areas of expertise as follows:
® Product &
Manufacturing Engineering
® Team
Building/Leadership
® Product
Development
® Wafer
Fabrication
|
® Electrical
Engineering
® DC
Testing/Troubleshooting
® Data Compilation/Analysis
® Quality
Control/Assurance
® Process
Improvement
|
® Packaging/Assembly
® Yield
Improvement
® Failure
Analysis
® Integrated
Circuit Design
® Problem
Solving
|
Professional Profile
Anadigics, Inc. · Warren, NJ 2005 - Present
New Product Development Engineer
® Accountable for leading the Product Implementation Team for the
transfer of products from development to manufacturing, as well as for
performing and presenting product engineering data analysis.
® Planned and managed product engineering tasks for the gate four
through gate five product release process and assembled, coordinated, and
presented gate four through gate five product release meetings.
® Assisted the design team with the coordination and management of lot
starts (wafer, laminate, and module), assembly, and testing during the design
phase.
® Coordinated and oversaw product development related activities
amongst related company functions, including design, failure analysis,
reliability, qualification, test, packaging/assembly, and fabrication.
® Specified, managed, and improved die-sort/final test requirements
for products under development and identified/resolved yield issues regarding
IC design, assembly/packaging, wafer fabrication, and testing.
AraLight, Inc. · Monroe
Manufacturing Engineer: ARL-36 Series
Transmitter/Receiver Pair
® Charged with DC test operation, process development/improvement,
training personnel, coordinating manufacturing activities, and conducting
safety evaluations/corrective actions to
ensure product quality.
® Performed and analyzed DC electrical measurements for
transmitter/receiver CMOS chips, as well as tested hybrid (36 channels TX &
RX) chips using the manual finger probing system.
® Analyzed data according to its output current, threshold, linearity
and power supply current and performed the flip chip bond process for VCSELs
and PINs (implemented the methods to apply epoxy on the die).
® Characterized and assembled all equipment in the manufacturing area,
including two Wedge Bonders, an Epoxy Die Bonder, and a Dage 4000.
® Optimized product quality by performing wire strength, loop height, and die shear testing for
a selected board in a shift using a Dage Series 4000.
® Improved the eye/mask from rise and fall time by analyzing P&N
wire length according to equal and shorter.
® Provided training, operator certification, and process documentation
in process improvement and yield improvement.
® Inspected PC Boards, before the TX & RX chips attached and wire
bond process.
Olivia Clarlee
Page 2
Professional Profile - Continued
Lucent Technologies · Murray Hill , NJ
Test Engineer
® Tested InP PIN and Avalanche Photo Detectors (APD), as well as evaluated
and optimized process equipment by experimentation and analysis of process
parameters.
® Implemented/maintained statistical process control methods, tested
wafers to determine characteristics, and determined if devices passed/failed at
end-of-wafer fabrication using electrical/visual testing.
® Sustained daily operations of the wafer/optical prober for
electrical testing while responsible for automated vision systems for visual
tests, including testing of product wafers, calibration, and equipment
maintenance.
® Handled technical direction, process improvements, training,
operator certification, yield improvement, and failure mode analysis.
® Sustained scribe/break, pick/place, and final hoop inspection
processes, as well as analyzed data (doping, junction and thickness) and
determined necessary corrective actions.
Applied Optoelectronics · Houston , TX
Packaging & Processing Engineer
® Packaged lasers/photo detectors in III-V materials (InP, GaAs, InAs,
GaSb) and developed a metallization
process and optimized packaging station. Implemented/characterized flow
station equipment, trained personnel, and updated process documentations.
® Sustained the wire bond process for bonding the laser/photo detector
on the ceramic piece using wedges and ball bonders.
® Performed the scribing operation, pick/place, and mounting the laser
on the sub mount while responsible for the fiber coupling alignment operation
of the Optical sub-assembly (OSA).
®
Processed laser/photodetector
in III-V materials (InP, GaAs, InAs, GaSb) and was responsible for the EPI characterization
process, including X-ray, scanning electron microscopy, and Nomarski lens.
® Set up optical and electrical
testing equipment.
Education & Certifications
® Lakehead University
® Certifications: SAS Applications, Avtech
Technical Skills
OS:
Windows
NT/XP/2000, MS-DOS
Languages:
SQL, C, C++
Tools: SQL Plus, SQL Loader,
SAS/Basic/Macros/Stat, SFDM (Shop Floor Data Manager), Static (5.2.8), AutoCAD14,
MathCAD, Origin, MS Office (Excel, PowerPoint, Word), Lab View, VHDL, FPGA, Spice.
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