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Joy Columbus
309
North Shore Road, Chester, NH 03001 · Home 603 887-9876 · Cell
603 661-1230 · email columbus.joy@gsinet.net
Materials
Electronics Engineer
Multi
discipline research and development engineer with solid project management
skills taking innovative technology through to product realization. Experienced in semiconductor process
development working with innovative crystals and component assembly processes
using ceramic materials. Project leader
characterizing sensor elements through to qualification. Personable, inquisitive, pragmatic individual
seeking to learn new technologies and materials.
CAREER HISTORY
SenGenuity,
Division of Vectron International Inc., Hudson, NH
Sensor R&D Engineer 2007
to 2011
Responsibilities
Design,
execute and analyze experiments to create novel acoustic sensor elements for
viscometers. Project manage sensor
elements and viscometers through company’s Product Realization Process. Develop and transfer all sensor coating
processes to manufacturing. Characterize
and analyze sensor elements in customers various fluid applications.
Accomplishments:
- Improved
adhesion of the sensor coating on quartz and implemented a revised
acoustic plate mode sensor element process development. Fully transferred high shear acoustic
viscometer through all stages of product realization using six-sigma and
DOE analysis concurrently with Quality standards.
- Researched, implemented and transferred to
manufacturing an effective langasite (La3Ga5SiO14)
cleaning process for the acoustic bolt viscometer.
- Investigated, executed and transferred to manufacturing
an etching process allowing to tune frequencies and to create novel
element electrode patterns onto langasite.
- Established,
verified, and managed langasite supply for wafer level fabrication. This effort reduced cost of langasite
sensor elements down to greater than 30%.
- Characterized
both pigmented and dye inks using the viscometer in solvent and water base
solutions while assisting customers in their assessment of our viscometer. Established fluorinated diamond like
carbon coating that created a lower surface tension coating for effective
cleaning with problem inks.
Vectron
International Inc., Hudson, NH
Sr. VCSO/SAW Product Engineer 2001 to 2007
Responsibilities:
Characterize,
qualify and transfer to manufacturing new surface acoustic wave (SAW)
oscillator products. Evaluate new
generation oscillators such as MEMs resonators.
Benchmark other industry oscillator products to support marketing and
product development specifications.
Support and troubleshoot all material issues for Returned Material
Analysis (RMA) to Quality.
Accomplishments:
·
Demonstrated low phase noise and jitter
surface acoustic wave dual output oscillator for telecommunications industry
back in 2001 and still is one of leading oscillator products for Vectron.
·
Evaluated and reported to upper
management results of MEMs oscillators. This investigation allowed the company
to strategize the next level of crystal oscillators.
·
Investigated and presented comparison
of competitor’s oscillator electrical performance and assembly technologies
using integrated ceramic substrates.
This effort allowed company to stay unique in oscillator products.
Raytheon
Research Division, formerly of Spring Street, Lexington, MA
Sr. Engineer 1983
to 2003
Hired
as a Research Associate then progressed to Sr. Engineer. Resigned in 2001 but
was asked to stay on a part time basis to finish transfer of a project while
working at Vectron International, Inc. from 2001 to 2003.
Responsibilities:
Initially
supported all crystal fabrication for R&D ultra low phase noise quartz
resonators. Proceeded to support R&D
in hybrid assembly and all phase noise, vibration and temperature testing.
Later supported the laser frequency trimming process of surface acoustic wave
(SAW) all-quartz packaged devices by depositing alumina oxide (Al2O3).
Accomplishments
·
Investigated and solved material issues
in oscillator assembly that adversely affected phase noise performance in
oscillators.
·
Managed the post laser deposition
process to frequency trim sealed AQP (All Quartz Package) devices by ablating
Al2O3 onto the active region of the SAW device.
EDUCATION and CERTIFICATIONS
Certificate of Project Management, University
of New Hampshire, Durham, NH
MS, Material Science/Chemical Engineering, GPA 3.5, University
of Massachusetts, Lowell MA
Bachelor of Science, Industrial Science, Fitchburg
State College, Fitchburg, MA
Major: Electrical Engineering
Honors: Magna Cum Laude
COMPUTER SKILLS
Microsoft
Excel, Access and Project
AutoCAD
COMSOL
Workshop
ASSOCIATIONS
Institute
of Electronics and Electrical Engineers (I.E.E.E.)
IEEE
Women in Engineering
Material
Research Society (MRS)
PUBLICATIONS
Addendum
ADDENDUM
PUBLICATIONS
Co-authored papers
J. Andle,
R. Haskell, R. Sbardella, G. Morehead, M. Chap, J. Columbus, and D. Stevens “Design,
Optimization and Characterization of an Acoustic Plate Mode Viscometer”, Sensors and Advanced
Packaging, Vectron International,
Hudson, NH 03051 USA
J.
Andle, R. Haskell, R. Sbardella, G. Morehead, M. Chap, J. Columbus and D.
Stevens “Design, Packaging and Characterization of a Two-Port Bulk Wave
Langasite Viscometer, Sensors and Advanced Packaging, Vectron
International, Inc., Hudson, NH 03051 USA
J. Andle, R. Haskell, M.
Chap, D. Stevens, J. Columbus, R. Gomes and L. Nguyen, “Mitigating Spurious Compressional Waves in Multi-Measurand Thickness
Shear Mode Sensors”, SenGenuity, Division of Vectron International, Inc.,
Hudson, NH 03051 USA
I.
D. Avramov and J. Columbus, “Performance Verification of Injection Locked
STW Clocks with BAW Crystal Stability”, IEEE Frequency Control Symposium, TimeNav 2007 Conference, Geneva
Switzerland.
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