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Texas Instruments, Houston , Texas
Clemson University , Clemson , South Carolina
University of South Carolina , Columbia , South Carolina
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Stephen
Chisholm
4421 Ficho Mountain Dr. Samsel, Texas 77112
SUMMARY
A highly qualified, results-driven
engineer with extensive experience in maintainability, FMECA, reliability
prediction, fault modeling, failure analysis, development, productization,
product engineering and characterization of new and existing products and
processes for mechanical and electrical hardware.
Areas of expertise include:
·
Maintainability: Specialty in downhole and heavy
machinery mechanical and electrical products. Expertise in reliability
centered maintenance in areas of mechanical, electrical and oil-field custom
products. Heavy involvement in hazard
identification, product improvements, screens and optimum maintenance schedules
for maximized reliability.
·
FMEA and FMECA: Experience
in FMEA, FMECA construction with
SAE J1739 and MIL-STD-1629A guidelines.
·
Reliability Predictions and Derating: Strong background with reliability predictions
and derating with MIL-HDBK-217, PRISM and Bellcore/Telcordia reliability
calculations.
·
Reliability Software:
Software background includes Relex,
Reliasoft and Isograph.
·
Electronics Circuits: Strong
circuit analysis and digital logic capabilities.
·
HALT and HASS: Extensive background in
HALT/HASS, accelerated testing, reliability modeling and field deration.
·
DOE: Broad background in process/product
improvements, DOE and ANOVA analysis.
·
Reliability Statistics:
Expertise in Weibull analysis, distribution analysis, parameter
estimation and confidence interval determination.
·
Reliability Improvement: Possesses a proven ability to dramatically
improve products and establish new fabrication processes.
·
Build-In Reliability: Combines a demonstrated technical background
with a logical, innovative approach to problem solving to design novel test
structures for rapid evaluation of reliability hazards.
Utilizes excellent communication
skills to coordinate efforts between diverse groups, build a positive rapport
with co-workers at all levels, and motivate teams to reach goals in a timely
manner. An adaptable, ambitious leader,
stays abreast of current developments in leading-edge technologies and evolves
to meet needs of a growing organization.
An outcome-oriented self-starter, consistently exceeds expectations in
fast-paced environments and ensures timely production of high-quality
products. Approaches each new challenge
with measurable goals for success.
EXPERIENCE
CONSULTANT,
2003- Present
Worked as a consultant for
engineering contracts in the aerospace, NASA space program, oil and gas
exploration and military defense industries for ARES Corporation, Jacobs
Engineering, Crane Aerospace, Halliburton, Astronautics, General Dynamics and
Smith’s Aerospace (currently GE Aviation).
Previously had worked with Texas Instruments for 17 years.
NASA (Jacobs/ARES), Clear Lake, TX
Safety and Reliability
Engineer
Currently
a contractor working for NASA, addressing probabilistic risk analysis
for the International Space Station predominately with mechanical equipment. Activities with NASA have included:
·
FMEA and CIL generation
for functional/assembly level.
·
PRA utilizing SAPHIRE
software to model complex systems.
·
Reliability and
maintainability analysis
·
Fault Tree generation of
hazards.
·
Safety and Hazard analysis.
·
Generation of Risk
Assessment Executive Summary Report (RAESR).
Crane Aerospace, Burbank , CA
Reliability Engineer
Performed
FMECAs at the piece-part level for LRUs involving brake systems for the A400
Airbus project.
Halliburton, Houston , Texas
Reliability Engineer
Reliability engineer for
Sperry-Sun division for downhole drilling tools used for oil drilling and
exploration. Involvement in both current
generation and next generation tools included:
·
Implementation of
FRACAS system for MTBF and Pareto analysis for system reliability and
sub-system hazard determination.
·
Maintainability
optimization with product improvements and maintenance analysis.
·
Determination
of reliability requirements for next generation tools.
·
Identification
of improvements necessary for the existing reliability process.
·
Implementation
of HALT stressing for PC boards with high failure rates.
Astronautics, Milwaukee , Wisconsin
Reliability Engineer
Examined aircraft
reliability for the Pilatus trainer aircraft
and the Airbus A380:
·
FMECA: Completed functional FMECA for
the control panel of the Pilatus trainer. Also completed piece-part FMECA for the
Airbus A380 power system.
·
HALT/HASS: Developed plan for HALT/HASS
implementation for electronic assemblies.
General Dynamics, Muskegon , Michigan
Reliability Engineer
Reliability development of
Future Combat Systems (FCS) tank development for Army/Marine Corps:
·
FMECA: FMECA construction at the
system integration level of design.
·
Reliability Prediction: Reliability
predictions using physics of failure by finite element modeling for
times-to-failure determination and by using similar vehicle predictions.
·
Critical Items: Development of
reliability critical items by lessons learned analysis.
·
Reliability Allocations: Reliability allocation of reliability
requirements from project approval stage.
·
Design-In-Reliability: Design in
reliability during the concept stage of development by determination of
critical items and eliminating identified areas of high stress.
·
Reliability Growth: Reliability growth projections and resource
allocation for sustained reliability improvement.
Smiths Aerospace, Grand Rapids , Michigan
Reliability Engineer
Reliability development of
the Common Computing Resource (CCR) for the 787 Boeing aircraft project. Design of LRU consisting of general
processing modules, fiber optic transceiver and power condition modeling. Areas of activity included:
·
Electronic Circuit Analysis: Electronic design analysis of analog and
digital circuitry during the design stage of LRU definition. Elimination/minimization of design hazards
for early detection and correction.
·
FMECA: FMECA construction for
circuit cards comprising the CCR LRU composition for determination of hazardous
failure modes and effects by circuit analysis.
·
Reliability Prediction: Reliability prediction by MIL-HDBK-217F
utilizing parts stress for MTBF determination.
·
HALT/HASS: Implemented
HALT/HASS reliability planning and reporting.
·
Relex: Relex software used for
reliability predictions and FMEA.
SVTronics, Dallas , Texas
Reliability Engineer, 2003 - 2004
Lead for reliability
development in contract manufacturing.
Areas of activity included.
·
Accelerated Testing: Developed insitu temp cycle
capabilities to evaluate surface mount packaging reliability.
·
Reliability Modeling: Established reliability models and derating
from accelerated data.
·
Reliability Facilities: Redesigned
facilities to enable reliability compliance with customer requirements.
·
Customer Interface: Built customer data base
from contacts established from industry experience.
Reliability Engineer, 1986 - 2003
Experience
included both government sectors (DSEG) and ASP sectors. Systems level reliability engineering
included:
·
FMEA/FMECA Construction: FMEAs at sub-LRU, LRU and systems level
integration.
·
Reliability Predictions: Electronic reliability predictions and
derating.
·
FRACAS: Utilized internal FRACAS program (QTS) for
reliability growth realization.
·
Weibull Analysis: Statistical reliability modeling of
accelerated failure data.
·
Environmental Testing: Vibration and temperature accelerating
studies.
Component level
activities included qualifications of new and existing processes and
products. Held responsibility for the
development of a center of excellence for board level reliability, and
development of new tests for board level reliability. Ran feasibility studies on existing equipment. Developed reliability test plans. Evaluated feasibility and cost analysis on
new equipment. Executed in-situ temp
cycle testing of BGA packages. Areas not
covered above include:
·
Reliability Testing: Established reliability deration models for failure
mechanisms seen in reliability studies.
Designed unconventional test structures for quick evaluations of
reliability hazards. Built reliability
into product/processes prior to qualification.
·
Failure Forecasting:
Applied stress data and a theoretical model based on device physics to
model behavior and predicted performance in absence of reliability models for
failure mechanisms.
·
Development Time
Reduction: Utilized discrete test structures as well as special vehicles to
statistically mimic full die reliability during the development cycle. This was used to quantify failure mechanisms
and catch new, unknown failure mechanisms early in development stage in order
to quickly fix these problems and boost probability of first pass full die
qualification.
·
Reliability
Assurance: Conducted accelerated tests and modeling to uncover and quantify
reliability risks and to design-in or screen-in reliability.
·
Wafer Stress Testing: Implemented
a wafer level stress test that modeled gate oxide reliability for the charge
trapping failure mechanism, which enabled rapid quantification of the
reliability of a given oxide. Applied
this test to a design-of-experiments matrix with a reoxidized nitrided oxide
process improvement to realize a process that created a ten-fold immunity in
charge trapping behavior.
·
Reliability Hazard
Reduction: Contributed
extensively to reliability hazard reduction in existing products and in some
cases mature products that had long been qualified. Typically during these times, worked heavily
with a team or multiple teams during the diagnostic journey to uncover the
cause of the problem and eliminate or control it and put wafer level/package
level monitors in place if necessary.
·
Process Improvements:
Executed qualifications of new and existing processes and products. Worked on existing problems to eliminate
issues that occurred in products that had already been qualified. Collaborated with fab to isolate faults,
realize rapid solutions, and determine process improvements to eliminate the
hazard.
ADDITIONAL
EXPERIENCE
Failure Analyst. Utilized SEM,
TEM, FIB, LIVA, TIVA, SQUID, SAM, EMMI and liquid crystal to resolve silicon
and package related failure mechanisms.
Isolated faults (scan chain) to accelerate problem solving efforts.
EDUCATION
M.S., Electrical
Engineering, 1986.
B.S., Electrical
Engineering, 1983.
Graduated
Cum Laude, Phi Beta Kappa, Tau Beta Pi.
PUBLICATIONS
1) P.L. Hefley and
J.W. McPherson, “The Impact of an External Sodium Diffusion Source on the
Reliability of MOS Circuitry”, Proc. 26th IEEE IRPS, 1988, pp.
167-172.
2) C. Dunn, P.L.
Hefley, et al., “Process Reliability Development for Nonvolatile Memories”,
Proc. 31st IEEE IRPS, 1993, pp. 133-146.
3) C. Dunn, P.L.
Hefley, et al., “Flash Eprom Disturb Mechanisms”, Proc. 32nd IEEE
IRPS, 1994, pp. 299-308.
4) P. Shah, P.L.
Hefley, et al., “Memory Cell Optimization and Charge Loss in 5V Only Flash
EEProms”, Novo Tech Review.
5) M. Gill, P.
Hefley, et al., “A Novel Sublithographic Tunnel Diode Based 5V Only Flash
Memory”, 1994 IEDM, pp. 119-122.
6) P.L. Hefley et
al., “A Model for the Bitline Stress Mechanism During Programming of Flash
Memories”, TI Internal Report #03-92-10.
7)
P.L. Hefley et al., “Process Optimization for Trap
Minimization Using Nitrided Oxides”, TI Internal Report #03-92-06.
PERSONAL
U.S. Citizen with U.S. Texas
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